The Scythe Rasetsu was officially released on July 19, 2010 which is exactly 6 months after the release of the Scythe Yasya.
The Rasetsu CPU cooler has it’s roots from the Yasya CPU cooler and is an improved follow up design. Scythe implemented much of the same design and thermal characteristics and technologies in the Rasetsu cooler as they have with the Yasya cooler, and it combines the design of the Yasya CPU Cooler with a top-flow layout.
The Yasya is a vertical air flow cooler design, which means that it will blow cool air from the inside of the computer case towards the exhaust fan of the computer case. The Rasetsu on the other hand is a horizontal air flow cooler design which will blow cool air from the inside of the case down toward the motherboard. In many cases this can enhance and improve PWM, mosfet and chipset cooling as well. Interestingly enough, Scythe included an airflow director that helps guide the hot exhaust air toward the system’s exhaust fan.
Both coolers feature the same 6 copper heatpipe construction. The 6 heatpipes extrude from the cooler base to the two sides of the cooler and then separate into a 3×3 configuration to make up the different sections of the heatsink fin design. The 6th heatpipe is well implemented and the amount of heatpipes is a big factor in transferring heat.
Both coolers implement the T.M.L.F.(Trident Multi-Layer Fin) structure which provides a higher intake volume, thus enabling a more efficient use of the six heatpipe construction. The Trident structure in essence is a set of fins with unequal sizes so that one fin protrudes the next, and the next and so on, and then the whole process in reverse where the next fin recesses the next, etc. This procedure gives the CPU fins a wave like pattern. The largest fins at the end of the cooler are not covered or overlapped by other fins in the cooler which allows them to release heat faster while the shorter fins increase spacing. This is what makes the Trident structure so efficient even at a overall lower fin count covering less surface area.
The Rasetsu / Yasya class coolers deploy the V.T.M.S. (Versatile Tool-Free Multiplatform System) for quick and safe mounting. This system is interchangeable between the coolers and is also deployed on other Scythe coolers. The system is meant to enable the quick unmount and remount of the CPU cooler. With this mechanism, extra care should be taken to ensure that all push pins are fastened securely and the mounting is solid.
The fin clearance should not interfere with standard height memory modules and should be able to accommodate even memory modules with extended heatspreaders. Memory modules with especially high heatspeaders such as the Corsair Dominator line may still not fit.
- V.T.M.S. (Versatile Tool-Free Multiplatform System)
Improved Version of VTMS allows multiplatform installation without any tools.
- Twist Intersected Pipe Structure
Twisted intersected 6 heatpipes achieves high heat transfer structure concentrated on to top flow heatsink layout.
- Trident Multi Layer Fin Structure
By placing the number of triangle shaped main & supplemental heatsink fins to maximize the air intake volume, heat absorb rate from the built-in heatpipes is ideal for extreme overclocking purposes as well as to cool the high-end multi-core CPU.
- Slip Stream120 PWM Adjustable
Equipped with Scythe original Slip Stream 120PWM adjustable fan, it allows a user to choose the fully automatic PWM feature fan speed control or alternatively adjust the PWM band range to fulfill demands from silent to high performance users.
The Scythe Rasetsu includes all mounting hardware for the majority of CPU socket configurations available to date.
Supported Sockets Include:
|Intel||775 / 1366 / 1156|
|AMD||754/ 939/ 940/ AM2/ AM3|